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ELECKO Technology CO.,LDT

   

 

 

 

 

XPM²-series    

(Reflow Soldering)  

 The Vitronics Soltec XPM² product platform represents the latest evolution of a long line of reflow systems that have proven their capability worldwide and established a reputation for incredible reliability. Insightful engineering combined with intelligent programming consistently deliver benchmark thermal performance, precise process control, and superior value for high production, 24 hours-a-day, 7days-a-week environments.

Designed to handle current technologies like Lead Free soldering for SMT and Semiconductor Packaging, XPM² posses inherent flexibility to address emerging technologies and is capable of virtually unlimited process configurations. There is no compromise with Vitronics Soltec XPM². Just what you'd expect from Vitronics Soltec, the World Leader in Soldering Technology.

 
FACILITIES REQUIREMENTS

 

 

XPM²520

XPM²730

XPM²820

XPM²940

XPM²1030

XPM²1240

Start-up power @ 400v

KVA

42

45

45

45

45

45

Process power @ 400v

KVA

10

12

12

15

15

17

Exhaust volume m³/hr/cfh

1000/600

Static pressure Pa/in-H2O

50/0.2

Standard Air:
Air Process volume

m³/hr/cfh

3/100

Air Process pressure

bar/psi

4/60

Air connection type mm / in

12.7/0.5 FNPT

Option Nitrogen Purge:

N©üQuick purge volume

m³/hr/cfh

75/2500

N©üQuick purge pressure bar/psi

5/70

N©üQuick purge time minutes

<20

Option Nitrogen:

N©üQuick purge volume(low)

m³/hr/cfh

12/400 | 17/600 | 17/600 | 23/800 | 28/1000

N©üQuick purge volume(high)

m³/hr/cfh

40/1400 | 45/16000 | 45/1600 | 51/1800 | 51/1800 | 57/2000

N©üQuick purge pressure bar/psi

4 / 60

N©üconnection type mm / in

12.7 / 0.5 FNPT

Option N©ü/Air Switching

Air supply volume

m³/hr/cfh

6/200

Air supply pressure bar/psi

4/60